What are the indicators of advanced packaging technology?

The indicators of advanced packaging technology mainly include the following aspects

1.3D packaging

(3D Packaging): This technology stacks multiple chips vertically and connects them using vertical interconnect technologies such as through-silicon vias (TSVs). 3D packaging can significantly increase chip integration and performance, reduce latency and power consumption, and is applicable in high-performance computing and storage fields.

2.Chip-level packaging

(Chip Scale Packaging, CSP): This technology completes the packaging process directly on the wafer and then cuts it into individual chips. CSP packaging makes the size of the packaged chip very close to the die size, significantly reducing the packaging size and increasing the packaging density, making it suitable for mobile devices and small electronic products.

3.2.5D and 3D integration

2.5D integration uses an intermediate layer to integrate multiple chip planes together, while 3D integration stacks chips vertically. Both 2.5D and 3D integration technologies not only enhance chip performance and efficiency but also make system design more flexible, suitable for high-performance computing, data centers, and high-end consumer electronics.

4.Intelligent Packaging

Smart packaging has "recognition" and "judgment" functions, capable of identifying and displaying parameters such as temperature and humidity, pressure, and sealing degree of the packaging space. For example, in fish or seafood packaging, smart packaging uses electronic sensors to detect pH value changes to determine the freshness of the contents.

5.Nanopackaging technology

Using nanotechnology to nanosynthesize, nanoadd, nanoremediate, or directly use nanomaterials in packaging materials to meet special functional requirements. Nanopackaging materials have high mechanical and ecological performance and are suitable for corrosion-resistant packaging, fireproof and explosion-proof packaging, hazardous material packaging, etc.

6.RFID technology

RFID (射频识别技术) is a non-contact automatic identification technology that uses radio frequency signals to automatically identify target objects and acquire related data. RFID tags have advantages such as readability, reusability, heat resistance, and resistance to contamination, and are widely used on product packaging, such as the UK government requiring RFID labels to be affixed to cigarette boxes to control smuggling, tax evasion, and counterfeiting in the tobacco industry.

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